Bonus share, dividend alert: Mold-Tek Packaging to reward shareholders on August 26

Bonus share, dividend alert: Mold-Tek Packaging to reward shareholders on August 26


Shares of Mold-Tek Packaging Ltd. were trading higher on Friday, August 21, after the company announced that its board will meet on August 26 to consider a proposal for the issue of bonus equity shares to existing shareholders.

The board will also consider recommending a final dividend on the company’s equity shares for the financial year ended March 31, 2026.

In addition, the board will consider the record date for the payment of the final dividend, if declared at the company’s 42nd Annual General Meeting (AGM), as well as the e-voting process for the AGM.

The announcement was disclosed to the stock exchanges on Friday during market hours.

This would be the first bonus issue since Mold-Tek Packaging’s listing, if approved by the board. The company had previously carried out a stock split in February 2016.

The quantum of the proposed bonus issue and the record date will be determined by the board.

As of the end of the June quarter, promoters held a 33.21% stake in Mold-Tek Packaging.Shares of Mold-Tek Packaging were trading 1.89% higher at ₹696.75 on Friday. The stock has gained more than 14% so far in 2026.



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